High-energy residual emission and collision/ionization with neutral gas
Ion acceleration due to positive bias near the target / Collision with the target and transferring momentum through the cathode sheath → Total bias (Vp-Vc): 200 ~ 1000eV by IV characteristics
Target leaving the lattice and moving to the substrate: 3~10eV
Secondary electron emission and self-discharge are maintained when ions collide with the target.
Collision of electrons with surrounding gas, generation of radical and negative ions / Impact of acceleration material along the anode sheath
Condensation and thin film formation on the surface of the released target particles
Effective Width | 400m less then |
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Film Thickness | 25㎛ or more |
Roll Diameter | 500m |
Pretreatm ent | Plasma Pretreatm ent |
Cathode | 1(Single)ea + 1(Dual)ea |
Sputter Power | DC 1ea + MF 1Set |
Heating System | IR-Heater / Drum |
Deposition effective width | 1500m |
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film thickness | 1500m |
Film roll diameter | 3000m |
Installed film length | 3000m |
film length | < 5.0E-5Pa |
maximum vacuum | < 5.0E-4Pa |
Reach input | Plasma treatment (ea) |
speaker device | 6(Single)ea+1(Dual)ea |
speaker power | MF(1)ea / DC(6)ea |
Giza heating device | IR Heater / Drum |
vacuum pump | Dry Pump+B |
Four Cold | |
vacuum chamber | drum/water |
Film substrate driving device | |
Plasma pretreatment | |
TMP / Cryo coil | |
Sputter device | Cathode (dual) |
Power output device | |
Gas supply control |